AI晶片軟硬整合方案
Integrated Hardware-Software Solutions for AI Chips
Dual-Core Vision Technologies for Smart Manufacturing
Technical Features
A 360° AI patrol system for smart factories enables full-area monitoring and anomaly detection, combined with FPGA-accelerated target alignment for semiconductor exposure tools to achieve high-speed, high-precision lithography.
Technical Description
This technology integrates a 360° AI patrol system for smart factories with FPGA-accelerated alignment technology for semiconductor exposure tools, delivering a solution that combines both speed and precision. The AI patrol system enables full-area monitoring and automatic anomaly detection, allowing managers to gain real-time visibility into production lines, quickly address potential issues, minimize downtime risks, and improve operational efficiency. Meanwhile, FPGA-accelerated image processing focuses on circular mark alignment in lithography processes. By leveraging parallel computing, it significantly reduces computation time and improves positioning accuracy, meeting the stringent requirements of high-density IC substrates and advanced wafer fabrication. Through the synergy of these two core technologies, manufacturers can lower production costs while increasing yield and throughput. This dual-core vision not only supports the transition toward intelligent, precise, and high-performance manufacturing but also highlights the essential value of smart manufacturing in driving the next generation of semiconductor production.
Contact
Name：張修誠
Phone：0926665788
E-mail：garnett@rockcoretek.com
