Technical Features

Innovative microstructure design combined with two-phase liquid cooling overcomes the thermal management bottleneck of high-power chips, enabling kilowatt-class efficient cooling.

Technical Description

【Pioneering the Next Generation of Advanced Thermal Management Solutions】
As high-performance computing and data centers face ever-increasing heat flux challenges, thermal efficiency becomes the cornerstone of system reliability and stability. At this exhibition, we proudly unveil our next-generation high-performance advanced thermal management solution, integrating two-phase cold plate architecture and innovative microstructures to effectively tackle the thermal demands of kW-class high-power chips.
Using two-phase flow simulation technology, we precisely navigate the complex physical phenomena during the cooling process, enabling us to optimize cooling structure design and achieve peak thermal efficiency in compact environments. We are dedicated to enhancing the operational stability and reliability of high-end chips under high heat flux conditions, while comprehensively strengthening our thermal management capabilities to support the evolving demands of next-generation servers and AI accelerators.
Whether for data centers, high-performance computing systems, or precision electronics, our technology solutions are designed to meet future thermal management needs for high-performance computing and data centers, empowering a more efficient and reliable digital future.

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