Technical Features

Integration of heterogeneous chips and passive components, utilizing new materials and optimized package structures to resolve warpage issues, has successfully passed automotive-grade reliability testing.

Technical Description

Multiple chips of varying sizes and functions, along with passive components, are integrated into a single package to achieve high integration and performance optimization. Meanwhile, by introducing new materials and modifying the package structure, warpage issues have been effectively resolved. The module has also passed automotive-grade reliability testing, demonstrating that it has reached the threshold for initial productization.

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