Fan-Out Wafer Level Packaging Shuttle Service Platform
Technical Features
ITRI provides mask sharing and small-batch, high-variety packaging services to accelerate the mass production and application of fan-out packaging.
Technical Description
ITRI, in collaboration with domestic industries, offers an innovative and flexible packaging integration service platform centered around fan-out packaging technology. The platform provides mask sharing, low-volume and diverse packaging services, along with standardized structural design guidelines and small-scale production support.
Photos
Contact
Name:余成駿
Phone:03-5917868
E-mail:itriA40084@itri.org.tw
