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Advanced Manufacturing & Packaging Equipment

Advanced Manufacturing& Packaging Equipment Fan-Out Wafer Level Packaging Shuttle Service Platform

Fan-Out Wafer Level Packaging Shuttle Service Platform

Technical Features

ITRI provides mask sharing and small-batch, high-variety packaging services to accelerate the mass production and application of fan-out packaging.

Technical Description

ITRI, in collaboration with domestic industries, offers an innovative and flexible packaging integration service platform centered around fan-out packaging technology. The platform provides mask sharing, low-volume and diverse packaging services, along with standardized structural design guidelines and small-scale production support.

Photos

Contact

Name:余成駿
Phone:03-5917868
E-mail:itriA40084@itri.org.tw