Technical Description

ITRI has developed an advanced multi-chip Antenna-in-Package (AiP) architecture that integrates a patented lead frame structure with high thermal conductivity and low thermal resistance die-attach technology. The development also includes novel low-polarity resin materials and encapsulated thermally conductive fillers designed for operation at frequencies above 60 GHz.
The suppression performance was improved by incorporating asymmetric high-frequency ferrite material technology and refining the deposition process parameters. ITRI is also actively building a patent portfolio for antenna and package co-design in millimeter-wave (mmWave) RF front-end modules. A dedicated verification platform for mmWave packaging characteristics has been established, along with the development of key low-dielectric-loss resin technologies-further encouraging domestic materials suppliers to invest in high-frequency packaging R&D and applications.
Key technical features include:
•Antenna-integrated PA package architecture with assembly temperature ≤ 225°C (thermal resistance R_JC: 0.563 °C/W; chip temperature: 72.514 °C)
•Low-loss, high thermal conductivity packaging materials: Df = 0.00054 (@100 GHz); thermal conductivity = 4.03 W/m·K
•High-performance EMI shielding materials: resistivity up to 3x10¹⁰ Ω·cm; EMI attenuation of 98.3% @100 GHz

Photos