Technical Features

This technology is based on the EPCIO control architecture and achieves a positioning accuracy of 100 nm. Combined with a high-speed trigger module, it fulfills the requirements for stable laser processing.

Technical Description

This technology centers on fully digital multi-axis motion control, integrating precision platform controller development, continuous position acquisition, and high-speed triggering technologies. It is applied to precision positioning platform of advanced semiconductor equipment. The controller is paired with a high-precision air-bearing experimental platform, which features a hybrid magnetic and hydrostatic design. By leveraging the low-friction characteristics of the air-bearing base, the system enhances structural rigidity through a combination of magnetic levitation and hydrostatic mechanisms. An adjustable damping system with both active and passive vibration suppression enables ±100 nm control accuracy, continuous multi-axis position acquisition at 250 kHz with no channel limit, and 3D coordinate triggering at up to 18 MHz. This supports semiconductor TGV (Through Glass Via) applications by resolving synchronization challenges between high-speed laser drilling and platform positioning, bridging critical gaps in domestic industrial capabilities.

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