Technical Features

Ultrafast laser processing technology is used to replace traditional mechanical wheel cutting in a non-contact manner to achieve local heating and material removal, avoiding cracking and chipping on the coated glass surface.

Technical Description

In the past, semiconductor components with multi-layer coatings were cut with diamond knives, which would be contaminated by cutting fluid and cracked at the edge of the film layer. This technology uses ultra-fast laser processing to make the cutting edge clean and pollution-free. It also successfully solves the problem of high stress generated by the contact type of traditional cutting machine blades, causing the coating layer to fall off or the glass edge to break. Through ultra-fast laser cutting technology, the edge smoothness is significantly improved and processing defects are reduced.

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