Empowering the Future of Data Centers: Silicon Photonics Technology
Technical Features
1.6Tbps optical engine powered by high-density photonic ICs and advanced optical packaging for next generation data centers.
Technical Description
To address the massive data transmission demands of next-generation AI computing and analytics, ITRI has collaborated with global industry partners to develop a 1.6T Optical Engine Module.
Focusing on high-speed optoelectronic transmission, this innovation delivers enhanced data processing performance and energy efficiency, empowering data centers with next-level capabilities.
The module integrates signals directly into silicon photonic chips through high-density heterogeneous integration, significantly shortening transmission paths and minimizing signal loss. It features multi-channel, high-precision optical fiber packaging and a silicon nitride WDM optical design, achieving high performance with packaging loss < -2 dB/Lane and optical path loss < -0.5 dB.
Plus, the innovative pluggable packaging interface has been exclusively patented, effectively addressing fiber pigtail interference issues during the CPO manufacturing process. It also offers high-temperature resistance and enhanced convenience for maintenance and testing.
This module is also highly compatible with existing packaging lines, supporting mass production and accelerating Taiwan’s industry alignment with global markets and next-gen server applications.
Photos
Contact
Name:蔡婷舜
Phone:03-5914480
E-mail:tstsai@itri.org.tw
